Solder Joint Reliability of BGA, CSP. Flip Chip, and Fine Pitch SMT – e848
Solder Joint Reliability of BGA, CSP. Flip Chip, and Fine Pitch SMT – e848

Solder Joint Reliability of BGA, CSP. Flip Chip, and Fine Pitch SMT – e848

USD 24.00 USD
SKU: 5q3mHN82
GTIN: 9780070366480
Condition: Like New
Tags: 1.1 in 1996 24.8 Oz 408 Pages 6.1 in 9.1 in 9780070366480 English Flip Chip Technologies Hardcover Textbook
Categories: Textbooks, Education & Reference

Specifications

ISBN9780070366480
Item Length9.1 in
Publication Year1996
TypeTextbook
FormatHardcover
LanguageEnglish
Item Height1.1 in
Item Weight24.8 Oz
Item Width6.1 in
Number Of Pages408 Pages

What stands out about this textbook is the comparative tables that show differences.

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